In the fast-paced industrial world, where innovation and efficiency are imperative, finding interconnection solutions on printed circuit boards (PCBs) has become a crucial challenge. The transition to lead-free soldering processes has posed significant hurdles, especially when it comes to connecting specialized components and large connectors. In this context, press-fit technology emerges as a solid and reliable alternative.
Press-fit Pins: A Two-Decade Journey
Press-fit pins have been on the market for over 20 years and are now widely used across a variety of industrial sectors. This technology is based on a special design of the insertion section of each pin, which creates a tight and robust interface with the metalized holes on the PCB, without the need for additional soldering processes.
The insertion section of the pin is slightly larger than the hole diameter, but is designed to deform during insertion. This creates a tight friction fit between the pin and the metalized surface.
“Needle Eye” Design for Maximum Retention
Over the years, various design strategies have been explored to ensure proper retention of press-fit pins. As this technology moves into new applications, such as Smart Junction Boxes in the automotive industry, it is critical that the force between the pin and the metalized surface withstands environmental and mechanical factors, such as heat, humidity, vibration and shock inherent in the automotive environment.
The “eye of the needle” approach has proven to be the most reliable technology for optimizing both initial force and long-term retention. The spring-like design used in these configurations ensures intimate and long-lasting contact with the metalized hole.
Current Capacity and Environmental Resistance
Press-fit terminals have excellent current capability, making them especially useful for high-power interconnects on copper-heavy PCBs. These boards, due to their thickness and characteristics, can be difficult to solder, complicating their transition to lead-free environments. By using press-fit interconnects, manufacturers can establish wider process control windows and eliminate special soldering requirements.
Rigorous Testing to Ensure Reliability
WORLDWIDE WCE press-fit technologies have been subjected to rigorous testing to meet industry standards such as SAE/USCAR-2, Rev4, EIA Publication 364 and IEC 60352-5 specifications. These tests evaluate environmental, mechanical and reliability factors under controlled conditions.
In summary, press-fit technology offers a robust and automatable alternative for PCB connections, without compromising quality or efficiency. Its application in the automotive industry and other sectors proves its worth as a reliable and robust solution for current and future challenges.
Press-fit technology: creating robust interconnections without soldering